TLP520-4 OPtocupler Price in Pakistan

Manufacturer Part Number:TLP520-4
Brand:Others
Package / Case:DIP16
Category:Integrated Circuits (ICs)
Warranty:100{7e82c6d62784066d1b113f595afb6e15f0ca3fec289cddd29e600df910d44428} Perfect Functions
All product names, trademarks, brands and logos used on this site are the property of their respective owners. The depiction, description or sale of products featuring these names, trademarks, brands and logos is for identification purposes only and is not intended to indicate any affiliation with or authorization by any rights holder.Parameter Symbol Conditions Min Typ Max Unit
Forward Voltage VF IF = 10 mA 1.0 1.3 1.6 V
Reverse Breakdown Voltage VBR IR = 1 mA – – 5.0 V
Peak Pulse Current IFPK tP = 1 ms – – 100 mA
Output Leakage Current IOL VCE = 5 V, TA = 25°C – 0.1 1.0 μA
Collector-Emitter Breakdown Voltage V(BR)CEO IC = 5 mA, IF = 0 mA – – 30 V
Maximum Operating Temperature TOP Continuous operation -40 – 85 °C
Storage Temperature TS Storage -40 – 125 °C
Instructions for Use:
Forward Voltage (VF):

Ensure the forward voltage across the LED does not exceed the maximum specified value to avoid damage.
Use a current-limiting resistor to maintain the forward current within the recommended range.
Reverse Breakdown Voltage (VBR):

Do not apply reverse voltage beyond the specified limit to prevent breakdown and potential failure.
Peak Pulse Current (IFPK):

The peak pulse current should not exceed the maximum rating to avoid overheating and damage.
Ensure that the pulse duration is within the specified limits.
Output Leakage Current (IOL):

The output leakage current can affect the performance of the circuit. Ensure that the load resistance is sufficient to handle this leakage.
Collector-Emitter Breakdown Voltage (V(BR)CEO):

The collector-emitter voltage should not exceed the maximum breakdown voltage to prevent damage to the device.
Maximum Operating Temperature (TOP):

Operate the device within the specified temperature range to ensure reliable performance and longevity.
Storage Temperature (TS):

Store the device in an environment within the specified storage temperature range to prevent damage from extreme temperatures.
Handling Precautions:

Handle the device with care to avoid mechanical damage.
Follow proper ESD (Electrostatic Discharge) handling procedures to prevent damage from static electricity.
Mounting:

Ensure proper mounting and soldering techniques to avoid thermal and mechanical stress on the device.
Use appropriate soldering temperatures and times to prevent damage during assembly.
Testing:

Test the device under controlled conditions to verify its performance and ensure it meets the required specifications.
(For reference only)